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lhg t680 multi topled ? common anode abgek ndigt nach pd_078_02 obsolete acc. to pd_078_02 2003-09-09 1 besondere merkmale ? geh ? usetyp: wei ? es p-lcc-4 geh ? use; kontrasterh ? hung durch schwarze oberfl ? che besonderheit des bauteils: additive farbmischung durch unabh ? ngige ansteuerung aller chips wellenl ? nge: 645 nm (hyper-rot), 570 nm (gr n) abstrahlwinkel: lambertscher strahler (120 ) technologie: algaas (hyper-rot), gap (gr n) optischer wirkungsgrad: 3 lm/w (hyper-rot), 2,5 lm/w (gr n) gruppierungsparameter: lichtst ? rke verarbeitungsmethode: f r alle smt-best cktechniken geeignet l ? tmethode: ir reflow l ? ten und wellenl ? ten (ttw) vorbehandlung: nach jedec level 2 gurtung: 8-mm gurt mit 8000/rolle, ? 330 mm anwendungen anzeigen im innenbereich (z.b. in laufschriftanzeigen) 3-farb-anzeigen (rot-gelb-gr n) leuchtdiodenchips getrennt ansteuerbar hinterleuchtung (lcd, schalter, tasten, displays, werbebeleuchtung, allgemeinbeleuchtung) einkopplung in lichtleiter f r automobil anwendungen nicht geeignet gleiche pinbelegung wie lhgb t686 features package: white p-lcc-4 package; higher contrast by a black surface feature of the device: additive mixture of color stimuli by independent driving of each chip wavelength: 645 nm (hyper-red), 570 nm (green) viewing angle: lambertian emitter (120 ) technology: algaas (hyper-red), gap (green) optical efficiency: 3 lm/w (hyper-red), 2.5 lm/w (green) grouping parameter: luminous intensity assembly methods: suitable for all smt assembly methods soldering methods: ir reflow soldering and ttw soldering preconditioning: acc. to jedec level 2 taping: 8 mm tape with 8000/reel, ? 330 mm applications indoor displays (e.g. light writing displays) 3-color-displays (red-yellow-green) led chips can be controlled separately backlighting (lcd, switches, keys, displays, illuminated advertising, general lighting) coupling into light guides not suitable for automotive applications same pin layout like lhgb t686
2003-09-09 2 lhg t680 helligkeitswerte werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 11 % ermittelt. luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of 11 %. abgek ndigt nach pd_078_02 / obsolete acc. to pd_078_02 letzte bestellung / last order: 30.09.2003 letzte lieferung / last delivery: 31.03.2004 anm.: die standardlieferform von serientypen beinhaltet eine familiengruppe. einzelne helligkeitsgruppen sind nicht bestellbar. in einer verpackungseinheit / gurt ist immer nur eine helligkeitsgruppe pro farbe enthalten. note: the standard shipping format for serial types includes a family group. individual luminous intensity groups cannot be ordered. no packing unit / tape ever contains more than one luminous intensity group per color. typ type emissionsfarbe color of emission lichtst ? rke luminous intensity i f = 10 ma i v (mcd) bestellnummer ordering code hyper-red green lhg t680 lhg t680-l+k lhg t680-l+l lhg t680-l+m lhg t680-m+k lhg t680-m+l lhg t680-m+m hyper-red green 11.2 ...28.0 11.2 ...18.0 11.2 ...18.0 11.2 ...18.0 18.0 ...28.0 18.0 ...28.0 18.0 ...28.0 7.1 ... 28.0 7.1 ... 11.2 11.2 ... 18.0 18.0 ... 28.0 7.1 ... 11.2 11.2 ... 18.0 18.0 ... 28.0 on request
lhg t680 2003-09-09 3 grenzwerte maximum ratings bezeichnung parameter symbol symbol werte values einheit unit lh lg betriebstemperatur operating temperature range t op ? 40 ? + 100 c lagertemperatur storage temperature range t stg ? 40 ? + 100 c sperrschichttemperatur junction temperature t j + 100 c durchlassstrom forward current ( t a =25 c) i f 30 ma sto ? strom surge current t 10 s, d = 0.005, t a =25 c i fm 0.5 a sperrspannung 1) reverse voltage ( t a =25 c) v r 512v leistungsaufnahme power consumption ( t a =25 c) p tot 90 95 mw w ? rmewiderstand thermal resistance sperrschicht / umgebung 2) 1 chip on junction / air 2) 2 chips on sperrschicht / l ? tpad 1 chip on junction / solder point 2 chips on r th ja r th ja r th js r th js 480 680 260 370 k/w k/w k/w k/w 1) f r kurzzeitigen betrieb geeignet / suitable for short term application 2) montage auf pc-board fr 4 (padgr ?? e 16 mm 2 ) mounted on pc board fr 4 (pad size 16 mm 2 )
2003-09-09 4 lhg t680 kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol werte values einheit unit lh lg wellenl ? nge des emittierten lichtes (typ.) wavelength at peak emission i f = 10 ma peak 660 572 nm dominantwellenl ? nge 1) (typ.) dominant wavelength i f = 10 ma dom 645 570 nm spektrale bandbreite bei 50 % i rel max (typ.) spectral bandwidth at 50 % i rel max i f = 10 ma ? 22 25 nm abstrahlwinkel bei 50 % i v (vollwinkel) (typ.) viewing angle at 50 % i v 2 ? 120 120 grad deg. durchlassspannung 2) (typ.) forward voltage (max.) i f = 10 ma v f v f 1.75 2.5 2.0 2.5 v v sperrstrom (tpy.) reverse current (max) v r = 12 v (green), v r = 5 v (hyper-red) i r i r 0.01 10 0.01 10 a a temperaturkoeffizient von peak (typ.) temperature coefficient of peak i f = 10 ma; ? 10 c t 100 c tc peak 0.28 0.11 nm/k temperaturkoeffizient von dom (typ.) temperature coefficient of dom i f = 10 ma; ? 10 c t 100 c tc dom 0.05 0.07 nm/k temperaturkoeffizient von v f (typ.) temperature coefficient of v f i f = 10 ma; ? 10 c t 100 c tc v ? 2.5 ? 1.4 mv/k optischer wirkungsgrad (typ.) optical efficiency i f = 10 ma opt 3 2.5 lm/w 1) wellenl ? ngen werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 1 nm ermittelt. wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm. 2) spannungswerte werden mit einer stromeinpr ? gedauer von 1 ms und einer genauigkeit von ?,1 v ermittelt. voltages are tested at a current pulse duration of 1 ms and a tolerance of ?.1 v.
lhg t680 2003-09-09 5 relative spektrale emission i rel = f ( ), t a = 25 c, i f = 10 ma relative spectral emission v( ) = spektrale augenempfindlichkeit standard eye response curve abstrahlcharakteristik i rel = f ( ? ) radiation characteristic % ohl01359 100 80 60 40 20 0 400 450 500 550 600 650 700 nm hyper-red i rel v green 0 0.2 0.4 1.0 0.8 0.6 ? 1.0 0.8 0.6 0.4 0? 10? 20? 40? 30? ohl01660 50? 60? 70? 80? 90? 100? 0? 20? 40? 60? 80? 100? 120?
lhg t680 2003-09-09 6 durchlassstrom i f = f ( v f ) forward current t a = 25 c relative lichtst ? rke i v / i v(10 ma) = f ( i f ) relative luminous intensity t a = 25 c relative lichtst ? rke i v / i v(25 c) = f ( t a ) relative luminous intensity i f = 10 ma maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current 10 1.4 5 -1 0 10 v f v 5 1 10 f ma 2 10 green hyper-red ohl01360 1.6 1.8 2.0 2.2 2.4 2.6 3.0 v v (20 ma) 10 -1 0 10 10 12 10 ma 10 -3 5 ohl01361 f i 5 -2 10 5 -1 10 0 10 1 10 i i 55 hyper-red green green 0 ohl01365 ? c a t 0 20 40 60 80 100 v v (25 ? c) i i 0.4 0.8 1.2 1.6 2 hyper-red ohl00110 0 i f t 0 ma a 20 40 60 80 ? c 100 10 20 30 40 2 chips on 1 chip on
lhg t680 2003-09-09 7 maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current ohl00111 0 i f t 0 ma s 20 40 60 80 ? c 100 10 20 30 40 2 chips on 1 chip on
lhg t680 2003-09-09 8 zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c green/hyper-red (1 chip on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c green/hyper-red (2 chips on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 85 c green/hyper-red (1chip on) zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 85 c green/hyper-red (2 chips on) ohl01686 s 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t d i t t p f t p = d = 0.005 0.01 0.02 0.05 0.2 0.5 dc 10 1 5 i f t 2 10 0.1 p 10 3 ma -5 10 0.2 0.1 0.005 0.02 ma ohl00121 0.5 10 0 p t i f d = -4 10 -3 10 -2 10 -1 10 0 10 1 10 s 1 10 2 10 3 10 p d t p t = t t f i -5 10 0.2 0.1 0.005 0.02 ma ohl00104 0.5 10 0 p t i f d = -4 10 -3 10 -2 10 -1 10 0 10 1 10 s 1 10 2 10 3 10 p d t p t = t t f i -5 10 0.2 0.1 0.005 0.02 ma ohl00122 0.5 10 0 p t i f d = -4 10 -3 10 -2 10 -1 10 0 10 1 10 s 1 10 2 10 3 10 p d t p t = t t f i
lhg t680 2003-09-09 9 ma ? zeichnung package outlines ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). gewicht / approx. weight: 35 mg gply6925 4 ? 1 0.12 (0.005) 0.18 (0.007) marking package 3.4 (0.134) 1 3.0 (0.118) 0.1 (0.004) typ (2.4 (0.094)) 4 3.7 (0.146) 3.3 (0.130) 0.5 (0.020) 1.1 (0.043) 0.4 (0.016) 0.6 (0.024) 2.1 (0.083) 1.7 (0.067) 0.8 (0.031) 0.6 (0.024) 2.6 (0.102) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 2 3 0.9 (0.035) 0.7 (0.028) c aa c circuit diagram 1 cathode hyper-red(h) 2 anode h, g 4 cathode green (g)
2003-09-09 10 lhg t680 l ? tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 ir-reflow l ? tprofil (nach ipc 9501) ir reflow soldering profile (acc. to ipc 9501) ohly0597 0 0 50 100 150 200 250 50 100 150 200 250 300 t t ? c s 240-245 ? c 10-40 s 183 ? c 120 to 180 s defined for preconditioning: up to 6 k/s ramp-down rate up to 6 k/s ramp-up rate up to 6 k/s defined for preconditioning: 2-3 k/s
lhg t680 2003-09-09 11 wellenl ? ten (ttw) (nach cecc 00802) ttw soldering (acc. to cecc 00802) ohly0598 0 0 50 100 150 200 250 50 100 150 200 250 300 t t c s 235 c 10 s c ... 260 1. welle 1. wave 2. welle 2. wave 5 k/s 2 k/s ca 200 k/s cc ... 130 100 2 k/s zwangsk ? hlung forced cooling normalkurve standard curve grenzkurven limit curves
2003-09-09 12 lhg t680 empfohlenes l ? tpaddesign ir reflow l ? ten recommended solder pad ir reflow soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohlpy439 padgeometrie f ? r verbesserte w ? rmeableitung improved heat dissipation paddesign for l ? tstoplack solder resist 1.1 (0.043) 4.5 (0.177) 1.5 (0.059) 2.6 (0.102) 3.3 (0.130) 0.5 (0.020) 7.5 (0.295) 0.4 (0.016) cathode marking kathoden markierung / cu fl ? che / 12 mm per pad 2 cu-area _ < 3.3 (0.130)
lhg t680 2003-09-09 13 empfohlenes l ? tpaddesign wellenl ? ten (ttw) recommended solder pad ttw soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohay0583 6.1 (0.240) 2.8 (0.110) 2 (0.079) 3 (0.118) 6 (0.236) 3.5 (0.138) 1.5 (0.059) 2 (0.079) 3.5 (0.138) 1 (0.039) 8 (0.315) 2.8 (0.110) 0.5 (0.020) 7.5 (0.295) solder resist l ? tstoplack pcb-direction bewegungsrichtung der platine 2 (0.079) padgeometrie f ? r improved heat dissipation verbesserte w ? rmeableitung paddesign for 2 cu fl ? che / > 12 mm per pad cu-area
2003-09-09 14 lhg t680 gurtung / polarit ? t und lage verpackungseinheit 8000/rolle, 330 mm method of taping / polarity and orientation packing unit 8000/reel, 330 mm ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). anm.: bezglich trockenverpackung finden sie weitere hinweise im internet und in unserem short form catalog im kapitel ?gurtung und verpackung? unter dem punkt ?trockenverpackung?. hier sind normenbezge, unter anderem ein auszug der jedec-norm, enthalten. note: regarding dry pack you will find further information in the internet and in the short form catalog in chapter ?tape and reel? under the topic ?dry pack?. here you will also find the normative references like jedec. ohay0139 4 (0.157) 2.9 (0.114) 1.5 (0.059) 4 (0.157) 3.6 (0.142) 3.5 (0.138) 2 (0.079) 1.75 (0.069) 8 (0.315) cc a
lhg t680 2003-09-09 15 published by osram opto semiconductors gmbh wernerwerkstrasse 2, d-93049 regensburg ? all rights reserved. attention please! the information describes the type of component and shall not be considered as assured characteristics. all typical data and graphs are basing on representative samples, but don t represent the production range. if requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. terms of delivery and rights to change design reserved. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. if printed or downloaded, please find the latest version in the internet. packing please use the recycling operators known to you. we can also help you get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components 1 may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 2 life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. revision history: 2003-09-09 date of change previous version: 2003-08-04 page subjects (major changes since last revision) 15 annotations 2002-07-23 3, 4 value (reverse voltage) 2002-09-18 all not for new designs 2002-11-18 3, 4 hyper-red: value (reverse voltage from 12 v to 5 v) 2003-02-11 1, 2 obsolete 2003-08-04 14 note: dry pack 2003-09-09 3 ambient temperature 2003-09-09

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